Transistor including reentrant profile

ABSTRACT

A transistor includes a substrate, an electrically conductive material layer, and an electrically insulating material layer. At least a portion of one or more of the substrate, the electrically conductive material layer, and the electrically insulating material layer define a reentrant profile.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a divisional application of U.S. application Ser. No. 12/713,264filed Feb. 26, 2010.

Reference is made to commonly-assigned, U.S. Pat. No. 7,923,313,entitled “METHOD OF MAKING TRANSISTOR INCLUDING REENTRANT PROFILE” filedFeb. 26, 2010.

FIELD OF THE INVENTION

This invention relates generally to semiconductor devices and, inparticular, to transistor devices.

BACKGROUND OF THE INVENTION

In semiconductor processing technology, planar substrate surfaces whichare horizontal with respect to a wafer surface are patterned byphotolithographic methods in combination with selective etchingprocesses. During the processing of integrated circuits, reliefs with apronounced topography are formed on the wafer or substrate surface.Typically, this type of relief includes surfaces which are inclined orvertical with respect to the substrate surface. As sizes of integratedcircuits continue to shrink, it is becoming more and more necessary topattern vertical or inclined device surfaces so as to functionallydifferentiate these devices over their vertical extent while stillmaintaining pattern alignment. Examples of these types of semiconductordevices include deep trench capacitors, stacked capacitors, and verticaltransistors.

Currently, it is not possible to put patterns directly on walls whichare vertical with respect to the substrate surface using conventionalphotolithographic techniques. Usually, vertical wall patterning of thisnature is accomplished using a suitable filler material which, whenpartially filling in a trench, acts as a mask for the portions of thewall located underneath while allowing for processing of the walls abovethe filler material. For example, when an oxide is to be depositedexclusively on vertical walls below a filler material, the oxide isfirst deposited or produced over the entire surface of the relief. Therelief or trench is initially completely filled with a suitable fillermaterial. Then, the filler material is recessed back to a depth thatjust covers the desired oxide. After uncovered sections of the oxide areremoved, the remaining filler material is removed.

Alternatively, when an oxide is to be deposited or produced only inupper regions of a vertical wall, an etching stop layer, for example, anitride layer is first provided over the entire surface of the entirerelief pattern. A different material, susceptible to directionaletching, for example, polycrystalline silicon, is used to fill therelief, and is etched back as far as the desired coverage depth of thefinal vertical oxide. After the etching stop layer is removed from theunfilled sections of the walls, an oxide is deposited or generated usinga thermal technique in the uncovered regions. Next, the oxide isanisotropically etched which removes the deposited oxide fromhorizontal. This is followed by removal of the filler material and,then, the removal of the etching stop layer.

There are deposition processes which can be used to deposit thin filmson vertical or inclined surfaces of a substrate relief. However, it isdifficult to control the thickness of the layer deposited. Typically,the thickness of the coating decreases as the depth of the reliefincreases, for example, as the length of the vertical or inclined wallincreases. As such, layers deposited using these types of depositionprocesses have considerable differences in thickness over the length ofthe relief. These types of deposition processes include plasma-enhancedchemical vapor deposition (PECVD) and diffusion-limited deposition ofsilicon oxide using tetraethyl orthosilicate (TEOS).

As such, there is an ongoing need to provide semiconductor devicearchitectures that include patterned vertical or inclined devicesurfaces. There is also an ongoing need to provide manufacturingtechniques capable of processing small device features of semiconductordevices without requiring high resolution alignment tolerances.

SUMMARY OF THE INVENTION

According to one aspect of the present invention, a transistor includesa substrate, an electrically conductive material layer, and anelectrically insulating material layer. At least a portion of one ormore of the substrate, the electrically conductive material layer, andthe electrically insulating material layer define a reentrant profile.

According to another aspect of the invention, the electricallyinsulating material layer is a first electrically insulating materiallayer, and the transistor includes a second electrically insulatingmaterial layer that conforms to the reentrant profile. In another aspectof the invention, a semiconductor material layer conforms to thereentrant profile in contact with the second electrically insulatingmaterial layer.

According to another aspect of the invention, the electricallyinsulating material layer and the electrically conductive material layerdefine the reentrant profile.

According to another aspect of the invention, a method of actuating asemiconductor device includes providing a transistor including asubstrate, a first electrically conductive material layer, anelectrically insulating material layer, the electrically insulatingmaterial layer including a reentrant profile relative to theelectrically conductive material layer; a second electrically conductivematerial layer located over the electrically insulating material layer;and a third electrically conductive material layer located over thesubstrate; applying a voltage between the second electrically conductivematerial layer and the third electrically conductive material layer; andapplying a voltage to the first electrically conductive material layerto electrically connect the second electrically conductive materiallayer and the third electrically conductive material layer.

BRIEF DESCRIPTION OF THE DRAWINGS

In the detailed description of the preferred embodiments of theinvention presented below, reference is made to the accompanyingdrawings, in which:

FIG. 1 is a schematic cross sectional view of a vertical transistor;

FIGS. 2 through 8 are schematic cross sectional views of process stepsassociated with an example embodiment of a method of manufacturing thevertical transistor shown in FIG. 1;

FIG. 9 is a graph showing performance transfer characteristics for thevertical transistor shown in FIG. 1; and

FIG. 10 is a graph showing performance I_(d)-V_(d) curve characteristicsfor the vertical transistor shown in FIG. 1.

DETAILED DESCRIPTION OF THE INVENTION

The present description will be directed in particular to elementsforming part of, or cooperating more directly with, apparatus inaccordance with the present invention. It is to be understood thatelements not specifically shown or described may take various forms wellknown to those skilled in the art.

Referring to FIG. 1, a schematic cross sectional view of a verticaltransistor 100 is shown. Transistor 100 includes a substrate 110, an (afirst) electrically conductive material layer 120, and an (a first)electrically insulating material layer 130. Transistor 100 also includesanother (a second) electrically insulating material layer 150, asemiconductor material layer 160, an electrode(s) 700, and an electrode800.

Conductive layer 120 is positioned between substrate 110 and insulatinglayer 130. A first surface of conductive layer 120 contacts a firstsurface of substrate 110 while a second surface of conductive layer 120contacts a first surface of insulating layer 130. Insulating materiallayer 130 is often referred to as a dielectric material layer. Substrate110, often referred to as a support, can be rigid or flexible.

Insulating layer 130, conductive layer 120, substrate 110, orcombinations thereof is appropriately dimensioned (or sized),positioned, or dimensioned and positioned relative to at least one otherlayer or substrate to create a reentrant profile 170 in transistor 100.As such, it can be said that at least a portion of one or more ofinsulating layer 130, conductive layer 120, substrate 110 defines thereentrant profile 170 of transistor 100. The reentrant profile 170shields at least some of conductive layer 120 from material deposited(or coated) using a directional (or line of sight) deposition (orcoating) process. The reentrant profile 170 allows at least some of theconductive layer 120 to be accessible to material deposited using aconformal deposition (or coating) process. For example, electricallyinsulating material layer 130 and electrically conductive material layer120 can define the reentrant profile 170.

As shown in FIG. 1, the reentrant profile 170 is defined by portions ofone or both of electrically insulating material layer 130 andelectrically conductive material layer 120. Insulating layer 130 issized and positioned to extend beyond conductive layer 120 such thatinsulating layer 130 creates a reentrant profile 170 relative toconductive layer 120. Alternatively stated, conductive layer 120 issized and positioned to end (in both the left and right directions asshown in FIG. 1) before insulating layer 130 ends such that conductivelayer 120 creates a reentrant profile 170 relative to insulating layer130.

Insulating material layer 150 conforms to the reentrant profile 170 oftransistor 100. Insulating material layer 150 includes first and secondsurfaces with the first surface being in contact with portions ofsurfaces of insulating layer 130, conductive layer 120, and substrate110. Semiconductor material layer 160 conforms to the reentrant profile170 of transistor 100. Semiconductor layer 160 includes first and secondsurfaces with the first surface being in contact with the second surfaceof insulating layer 150. Distinct (or separate, different) portions ofthe second surface of semiconductor layer 160 are in contact withelectrode(s) 700 and electrode 800.

Electrode(s) 700 includes another (a second) electrically conductivematerial layer 710. Electrode 800 includes yet another (a third)electrically conductive material layer 810. Electrode(s) 700 andelectrode 800 are positioned spaced apart from each other at differentlocations of transistor 100. The second and the third electricallyconductive material layers 710, 810 can be the same material layer. Whenthis is done, electrode(s) 700 and electrode 800 are included indistinct portions of the same electrically conductive material layer,either material layer 710 or material layer 810. Alternatively, thesecond and the third electrically conductive material layers 710, 810can be distinct (different) material layers.

Conductive layer 120 functions as the gate of transistor 100. In someexample embodiments of transistor 100, electrode(s) 700 functions as thedrain of transistor 100 and electrode 800 functions as the source oftransistor 100. In other example embodiments of transistor 100,electrode(s) 700 functions as the source and electrode 800 functions asthe drain.

The semiconductor device is actuated in the following manner. Aftertransistor 100 is provided, a voltage is applied between the secondelectrically conductive material layer 710 and the third electricallyconductive material layer 810. A voltage is also applied to the firstelectrically conductive material layer 120 to electrically connect thesecond electrically conductive material layer 710 and the thirdelectrically conductive material layer 810.

The reentrant profile 170 of transistor 100 allows a dimension of thesemiconductor material channel of the transistor to be associated withthe thickness of the conductive layer 120, which functions as the gate,of transistor 100. Advantageously, this architecture of the presentinvention reduces reliance on high resolution or very fine alignmentfeatures during the manufacture of transistors that include smallchannels.

Referring to FIGS. 2 through 8, schematic cross sectional views ofprocess steps associated with an example embodiment of a method ofmanufacturing transistor 100 are shown.

Generally described, transistor 100 is fabricated in the followingmanner. A substrate 110 is provided including in order an electricallyconductive material layer 120 and an electrically insulating materiallayer 130. A resist material layer 140 over electrically insulatingmaterial layer 130. Resist material layer 140 is patterned to expose aportion of electrically insulating material layer 130. The exposedportion of electrically insulating material layer 130 is removed toexpose a portion of electrically conductive material layer 120. Theexposed portion of electrically conductive material layer 120 isremoved. Removal of conductive material layer 120 continues to create areentrant profile 170. As shown in FIG. 1, the reentrant profile 170 iscreated by the removal of some of electrically conductive material layer120 while some of electrically insulating material layer 130 remains. Inthis sense, it can be said that the reentrant profile 170 is created inconductive material layer 120 relative to electrically insulatingmaterial layer 130. After removal of photoresist layer 140, if such isnecessary, substrate 110 and the remaining exposed material layers 120,130 are conformally coated with a second electrically insulatingmaterial layer 150. Second electrically insulating material layer 150 isconformally coated with a semiconductor material layer 160. Anelectrically conductive material layer, either 710 or 810, or layers710, 810 is directionally deposited over semiconductor material layer160.

The resist material layer 140 can be deposited over electricallyinsulating material layer 130 and patterned in the same process step. Aliquid etchant can be used to remove the exposed portion of theelectrically insulating material layer 130 to expose a portion of theelectrically conductive material layer 120. The same liquid etchant thatis used to remove the exposed portion of the electrically insulatingmaterial layer 130 can be used to remove the exposed portion of theelectrically conductive material layer 120 to create the reentrantprofile 170 in the electrically conductive material layer 120.

In some example embodiments, substrate 110 can include more than onematerial layer. The additional material layer(s) is included in someinstances to improve or maintain the structural integrity of substrate110 during the manufacturing process. When substrate 110 includes morethan one material layer, for example, a first layer and a second layer,the fabrication method can include removing the second layer ofsubstrate 110.

Referring back to FIG. 2, a schematic cross sectional view of transistor100 material layers prior to material processing is shown. Themanufacturing process for forming the vertical transistor device beginswith a substrate 110 that is non-conductive, either in whole or in partwith respect at least the portion of the substrate that is adjacent toconductive layer 120 (the top of the substrate 110 as shown in FIG. 2),such that electrical shorting of transistor 100 does not occur.Conductive layer 120 is applied to or deposited onto substrate 110.Conductive layer 120 functions as the gate of transistor 100 and by itsthickness (in the vertical direction as shown in FIG. 2) defines alength of the gate by its thickness. A dielectric non-conductive layer130 is applied to or coated on conductive layer 120. Non-conductivelayer 130 is a uniform layer with no pattern. A resist layer 140 isapplied to dielectric non-conductive layer 130. Resist 400 is patterned.

Substrate 110 does not interact appreciably with any of the layers orthe processing methods. Substrate 110, often referred to as a support,can be used for supporting the thin film transistor (also referred to asa TFT) during manufacturing, testing, and/or use. Those skilled in theart will appreciate that a support selected for commercial embodimentscan be different from one selected for testing or screening embodiments.In some embodiments, substrate 110 does not provide any necessaryelectrical function for the TFT. This type of substrate 110 is termed a“non-participating support” herein. Useful substrate materials includeorganic or inorganic materials. For example, substrate 110 can includeinorganic glasses, ceramic foils, polymeric materials, filled polymericmaterials, coated metallic foils, acrylics, epoxies, polyamides,polycarbonates, polyimides, polyketones,poly(oxy-1,4-phenyleneoxy-1,4-phenylenecarbonyl-1,4-phenylene)(sometimes referred to as poly(ether ether ketone) or PEEK),polynorbornenes, polyphenyleneoxides, poly(ethylenenaphthalenedicarboxylate) (PEN), poly(ethylene terephthalate) (PET),poly(ether sulfone) (PES), poly(phenylene sulfide) (PPS), andfiber-reinforced plastics (FRP). The thickness of substrate 110 canvary, typically from about 100 μm to about 1 cm.

A flexible support or substrate 110 is used in some example embodimentsof the present invention. Using a flexible substrate 110 allows for rollprocessing, which can be continuous, providing economy of scale andeconomy of manufacturing over flat or rigid supports. The flexiblesupport chosen is preferably capable of wrapping around thecircumference of a cylinder of less than about 50 cm in diameter, morepreferably 25 cm in diameter, and most preferably 10 cm in diameter,without distorting or breaking, using low force as by unaided hands. Thepreferred flexible support can be rolled upon itself. Additionalexamples of flexible substrates include thin metal foils such asstainless steel provided the foils are coated with an insulating layerto electrically isolate the thin film transistor. If flexibility is nota concern, then the substrate can be a wafer or sheet made of materialsincluding glass and silicon.

In some example embodiments, substrate 110 can include a temporarysupport or support layer, for example, when additional structuralsupport is desired for a temporary purpose, e.g., manufacturing,transport, testing, or storage. In these example embodiments, substrate110 can be detachably adhered or mechanically affixed to the temporarysupport. For example, a flexible polymeric support can be temporarilyadhered to a rigid glass support to provide added structural rigidityduring the transistor manufacturing process. The glass support can beremove from the flexible polymeric support after completion of themanufacturing process.

The conductive layer 120, commonly referred to as a conductor, can beany suitable conductive material that permits conductive layer 120 tofunction as a gate. A variety of gate materials known in the art arealso suitable, including metals, degenerately doped semiconductors,conducting polymers, and printable materials such as carbon ink,silver-epoxy, or sinterable metal nanoparticle suspensions. For example,the gate electrode can include doped silicon, or a metal, such asaluminum, chromium, gold, silver, nickel, copper, tungsten, palladium,platinum, tantalum, and titanium. Gate electrode materials can alsoinclude transparent conductors such as indium-tin oxide (ITO), ZnO,SnO2, or In2O3. Conductive polymers also can be used, for examplepolyaniline, poly(3,4-ethylenedioxythiophene)/poly(styrene sulfonate)(PEDOT:PSS). In addition, alloys, combinations, and multilayers of thesematerials can be used.

The gate electrode can be deposited on substrate 110 using chemicalvapor deposition, sputtering, evaporation, doping, or solutionprocessing. In some embodiments of the invention, the same material canprovide the gate electrode function and also provide the supportfunction of substrate 110 provided substrate 110 also includes aninsulating layer to electrically isolate transistor 100. For example,doped silicon can function as the gate electrode and support the TFT.

The thickness (the vertical direction as shown in FIG. 2) of the gateelectrode can vary, typically from about 100 to about 10000 nm. As thethickness defines the gate length, the thickness is usually thicker thantwice the thickness of the conformally coated materials in order toreduce the likelihood of electrical shorting.

As shown in FIG. 2, nonconductive layer 130 is coated uniformly over theconductive layer 120. Examples materials suitable for use innonconductive layer 130 include strontiates, tantalates, titanates,zirconates, aluminum oxides, silicon oxides, tantalum oxides, titaniumoxides, silicon nitrides, barium titanate, barium strontium titanate,barium zirconate titanate, zinc selenide, and zinc sulfide. In addition,alloys, combinations, and multilayers of these examples can be used fornonconductive layer 130, commonly referred to as the gate dielectric. Ofthese materials, aluminum oxides, silicon oxides, and zinc selenide arepreferred. In addition, polymeric materials such as polyimides,polyvinyl alcohol, poly(4-vinylphenol), polyimide, and poly(vinylidenefluoride), polystyrene and substituted derivatives thereof, poly(vinylnaphthalene) and substituted derivatives, and poly(methyl methacrylate)can be used.

Nonconductive layer 130 is coated with a resist 400. Resist 400 ispatterned. Resist 400 can be a conventional photoresist known in the artsuch as a polymeric positive acting resist or a negative resist. Resist400 is exposed through a mask with a low resolution (>1 mm) alignment tosubstrate 110 and developed to yield a pattern of resist. In anotherexample embodiment, the pattern of resist 400 is accomplished using aprinting process, such as flexography or inkjet printing, that printsthe resist directly in a patterned manner without using a mask.

Referring back to FIGS. 3-5, a schematic cross sectional view oftransistor 100 material layers during and after material processing areshown. In FIG. 3, nonconductive layer 130, commonly referred to as anonconductor, is etched through patterned resist 400. The etchant can beany organic or inorganic material which removes the nonconductivematerial without substantial attacking resist 400 or the underlyingconductor layer 120. Conductor 120 is then removed using a suitableetchant which removes the conductor 120 but has little impact onsubstrate 110 or the overlying nonconductor 130. As such, the selectedetchant often depends on the substrate 110, the conductor, 120, or thenonconductor 130. Etchant interaction with resist 140 and loss of theresist 140 at this point is usually of little consequence, since thenonconductor 130 now acts as a mask. As shown in FIG. 3, the etchingprocess or processes used etch away portions of conductor 120 andnonconductor 130 such that conductor 120 and nonconductor 130 have thesame pattern.

As shown in FIG. 4, selective etching of conductor 120 is continueduntil the reentrant profile 170 shown in FIG. 4 is formed. When etchingof conductor 120 is complete, nonconductor 130 overhangs conductor 120which creates a reentrant profile 170 that is sufficient to shield atleast some of the underlying surface (of either conductor 120 orsubstrate 110) from coating by a directional (or line-of-sight) coatingsource positioned above (as shown in FIG. 4) substrate 110.Alternatively stated, conductor 120 underhangs nonconductor 130. Theremaining conductor 120 acts as the gate conductor when thesemiconductor device is complete.

At this point, if it is necessary, resist 140 is removed. Gentlecleaning can be performed on the material layer stack, if desired,provided that the cleaning process does not remove the reentrant profile170. FIG. 5 shows a cross sectional view of the semiconductor deviceafter the reentrant profile 170 has been created and after resist hasbeen removed.

Referring back to FIGS. 6 and 7, schematic cross sectional views of thesemi-conductor device after conformal coating of a dielectricnonconductive material, often referred to as an insulator, and asemiconductor material, respectively, are shown. In FIG. 6, a dielectricnonconductive material 150 is then conformally coated using a conformalcoating deposition process over substrate 110 and the topographicfeature formed by material layers 120 and 130. Applying nonconductivematerial 150 using a conformal coating process helps to maintain thereentrant profile 170. Nonconductive material 150 is often referred toas the gate dielectric. Suitable nonconductive materials includestrontiates, tantalates, titanates, zirconates, aluminum oxides, siliconoxides, tantalum oxides, titanium oxides, silicon nitrides, bariumtitanate, barium strontium titanate, barium zirconate titanate. As thedielectric material separates the gate conductor from the semiconductormaterial that is to be applied, it is important that the conformallycoated material be provided with a consistent or uniform thickness atleast in the region where the reentrant profile 170 and the gate arelocated.

Preferred processes for accomplishing conformal coating include atomiclayer deposition (ALD) or one of its derivatives such as spatial ALD(S-ALD) or plasma enhanced ALD (PEALD) because these processes yield auniform thickness coating over or on a highly varying topology. ALD andS-ALD are discussed in more detail below.

In FIG. 7, a semiconductor material 160 is then coated using a conformalcoating deposition process which helps to maintain the reentrant profile170. This conformal coating process can be the same process usedpreviously to coat the dielectric material. Alternatively, the conformalcoating process can be different. As the semiconductor material 160 actsas a channel between electrode 700 and 800 when gate 120 is energized,it is important that the conformally coated material be provided with aconsistent or uniform thickness at least in the region where thereentrant profile 170 and the gate are located and more preferable inthe areas between electrode(s) 700 and electrode 800 including the areawhere the reentrant profile 170 and the gate are located. A preferredprocess for conformally coating is atomic layer deposition (ALD) or oneof its various derivatives such as spatial ALD (S-ALD). This processyields a uniform thickness on a highly varying topology. ALD and S-ALDare discussed in more detail below.

The semiconductor material layer 160, often referred to as asemiconductor, can be any type of semiconductor provided thesemiconductor material can be deposited or coated using a conformalcoating process such as ALD. Examples of suitable semiconductormaterials include zinc oxide, zinc chalcogenides, cadmium chalcogenides,gallium pnictides, aluminum nictides, or silicon.

The semiconductor can optionally be doped with other materials toincrease or decrease the conductivity. In some example embodiments, adepletion mode device is desirable, and therefore carriers can be addedthrough the use of dopants. When the semiconductor is a zinc oxide, theuse of an aluminum dopant, for example, increases the electron carrierdensity. In this configuration, the gate is typically used to turn offthe device by making it negative relative to the drain and source.

A compensating dopant can also be used to deplete the intrinsic carrierdensity. When the semiconductor is zinc oxide, the use of nitrogen hasbeen found to decrease the electron carrier density making it lessn-type. In this configuration, the semiconductor can be made to operatein an accumulation mode to turn on the transistor when a positive gatevoltage is applied. These dopants are often added as compounds duringthe growth process but can also be added after the semiconductor layerhas been applied using a process such as ion implantation and thermaldiffusion.

Referring back to FIG. 8, a schematic cross sectional view of thesemi-conductor device during directional coating of an electricallyconductive material is shown. After semiconductor layer 160 has beendeposited, the source and drain electrode(s) 700 and electrode 800 aredeposited using a directional (or line-of-sight) deposition processwhich does not deposit or coat material into the reentrant profile 170.Examples of suitable directional deposition processes include thermalevaporation, electron beam evaporation, sputtering, or laser ablation.The active channel gap between electrode(s) 700 and electrode 800 ismaintained by the shadow casted by the overhang of nonconductive layer130 relative to conductive material layer 120.

Referring back to FIG. 1, transistor 100 after electrode(s) 700 andelectrode 800 have been deposited is shown. The drain and the source oftransistor 100 can be selected from either of electrode 700 andelectrode 800 with the selection typically being based on theapplication and the characteristics of the contemplated device. As shownin FIG. 1, electrode 800 is on the top of the mesa formed bynonconductor 130 and conductor 120 while electrode(s) 700 is not. Assuch, electrode 700 and electrode 800 are on different planes. Anynecessary interconnects can be accomplished using conventionaltechniques, for example, layer leveling and via feed through, well knownin the art.

Substrate 110, conductive layer 120, nonconductive layer 130,nonconductive layer 150, semiconductor layer 160, or combinationsthereof can include one or more layers provided the functional aspect ofthe layer remains unchanged. Additional layers, for example, levelinglayers, barrier layers, adhesion layer, can be included in thesemiconductor device as long as the function of the layers describedabove is preserved.

Atomic Layer Deposition (ALD) is a process which is used to producecoatings with thicknesses that can be considered consistent, uniform, oreven exact. ALD produces coatings that can be considered conformal oreven highly conformal material layers. Generally described, an ALDprocess accomplishes substrate coating by alternating between two ormore reactive materials, commonly referred to a precursors, in a vacuumchamber. A first precursor is applied to react with the substrate. Theexcess of the first precursor is removed is removed from the vacuumchamber. A second precursor is then applied to react with the substrate.The excess of the second precursor is removed from the vacuum chamberand the process is repeated.

Recently, a new ALD process has been developed which negates the needfor a vacuum chamber. This process, commonly referred to as S-ALD, isdescribed in at least one of U.S. Pat. No. 7,413,982, U.S. Pat. No.7,456,429, US 2008/0166884, and US 2009/0130858, the disclosures ofwhich are incorporated by reference herein. S-ALD produces coatings withthicknesses that can be considered consistent, uniform, or even exact.S-ALD produces coatings that can be considered conformal or even highlyconformal material layers. S-ALD is compatible with a low temperaturecoating environment and provides the ability to use higher mobilitymaterials when compared to other coating techniques. Additionally, S-ALDis compatible with web coating, making it attractive for large scaleproduction operations. Even though some web coating operations mayexperience alignment issues, for example, web tracking or stretchingissues, the architecture of the present invention reduces reliance onhigh resolution or very fine alignment features during the manufacturingprocess. As such, S-ALD is well suited for manufacturing the presentinvention.

Experimental Results

A 600 nm layer of chromium was deposited via sputtering on a 62.5 mmsquare silicon substrate coated by a thermal oxide layer. On top ofthis, a 120 nm aluminum oxide layer was coated at 200 degrees Celsiususing the S-ALD process described in U.S. Pat. No. 7,413,982 and theS-ALD apparatus described in U.S. Pat. No. 7,456,429 with theorgano-metallic precursors trimethyl aluminum and water with an inertcarrier gas of nitrogen.

A patterned layer of photoresist was formed by spin coating at 1000 rpmMicroposit S1805 resist (Rohm and Haas Electronic Materials LLC,Marlborough, Mass.) placed on a hot plate for 60 sec at 115 degreesCelsius and then exposed through a glass/chromium contact mask includinglines for 70 seconds on a Cobilt mask aligner (Cobilt model CA-419 fromComputervision Corporation, Sunnyvale, Calif.), using only the edges ofthe silicon substrate as a low resolution or crude alignment. The samplewas then developed for 60 seconds in Microposit MF-319 developer (Rohmand Haas Electronic Materials LLC, Marlborough, Mass.) and rinsed for 5minutes in DI water.

The nonconductive aluminum oxide was etched at 60 degrees Celsius withconcentrated phosphoric acid for 6.5 minutes. The chromium was etchedusing a chromium etch including a 0.6 M solution of ceric ammoniumchloride with 8% acetic acid. The exposed chromium was etched visiblythrough in 13.3 minutes. Undercut etching was accomplished via 2 minutesof continued etching. The substrate was then rinsed in DI water for 5minutes, rinsed with acetone to remove the photo resist, then rinsed inHPLC grade isopropanol, and then allowed to dry.

The substrate was then coated as described above with an additionallayer 120 nm thick of aluminum oxide conformally using the S-ALDapparatus and process. The substrate was then coated with a 25 nm layerof zinc oxide using the precursors diethyl zinc and concentrated ammoniasolution and nitrogen as the carrier gas.

The electrodes were applied by evaporation. Aluminum was evaporatedthrough a shadow mask including square holes which ran perpendicular andcompletely cross each line on the substrate. The aluminum was 70 nmthick.

Testing of the transistor was accomplished by using a probe station tocontact the aluminum on top of the line, the aluminum on one side of theline and the chromium gate metal which acts as the gate. Referring toFIG. 9, a graph showing performance transfer characteristics for thetransistor is shown. As can be seen in FIG. 9, the drain current versusgate voltage is constant at a drain voltage of 20 volts. The gatecurrent which has very little leakage at all gate voltages is alsoshown. It can also be seen that the drain current responds well to thegate voltage, ranging from a small current of about 10⁻¹¹ amps at a gateof −2 volts to almost a milliamp at a gate of 10 volts. Referring toFIG. 10, a graph showing performance I_(d)-V_(d) curve characteristicsfor the transistor is shown. As can be seen in FIG. 10, the draincurrent versus drain voltage is very responsive to the gate voltage.Test results of the devices also show a respectable on/off of greaterthan 10⁷ for a drain voltage of 20 V and gate voltage of 10V.

The invention has been described in detail with particular reference tocertain preferred embodiments thereof, but it will be understood thatvariations and modifications can be effected within the scope of theinvention.

PARTS LIST

-   100 transistor-   110 substrate-   120 conductor-   130 nonconductor-   140 resist-   150 gate dielectric-   160 semiconductor-   170 reentrant profile-   700 electrode-   710 second electrically conductive material layer-   800 electrode-   810 third electrically conductive material layer

1. A method of actuating a semiconductor device comprising: providing a transistor including: a substrate; a first electrically conductive material layer; an electrically insulating material layer, the electrically insulating material layer including a reentrant profile relative to the electrically conductive material layer; a second electrically conductive material layer located over the electrically insulating material layer; and a third electrically conductive material layer located over the substrate; applying a voltage between the second electrically conductive material layer and the third electrically conductive material layer; and applying a voltage to the first electrically conductive material layer to electrically connect the second electrically conductive material layer and the third electrically conductive material layer.
 2. The method of claim 1, wherein providing the electrically insulating material layer of the transistor includes providing an electrically insulating material layer extends beyond and overhangs the electrically conductive material layer such that the electrically insulating material layer and the electrically conductive material layer define the reentrant profile.
 3. The method of claim 1, wherein providing the transistor includes providing a semiconductor material layer that conforms to the reentrant profile and is in contact with the second electrically conductive material layer, and the third electrically conductive material layer.
 4. The method of claim 1, the electrically insulating material layer being a first electrically insulating material layer, wherein providing the transistor includes providing a second electrically insulating material layer that conforms to the reentrant profile.
 5. The method of claim 4, wherein providing the transistor includes providing a semiconductor material layer that conforms to the reentrant profile and is in contact with the second electrically insulating material layer, the second electrically conductive material layer, and the third electrically conductive material layer.
 6. The method of claim 1, wherein providing the transistor includes providing a flexible substrate.
 7. The method of claim 1, wherein providing the second electrically conductive material layer and the third electrically conductive material layer of the transistor includes providing distinct portions of the same electrically conductive material layer that function as a first electrode and a second electrode of the transistor. 